All for Joomla All for Webmasters

Additional Processing

3

Modern MEMS device production requires more than just traditional silicon wafer processing. Wafer bonding, mask making and plating are just a few of the additional fabrication processes we offer.

Capabilities

  • Wafer probing
  • Anodic bonding
  • Mask making
  • Spin-on-glass (SOG)
  • Flexible film bonding