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Technology

 

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The main clean rooms cover a total area of 220 m². There is a Clean room for lithography process in range 1000 class and there are three additional modular clean rooms for deposition, furnace and back-end processes (Class 10000).

In addition we have special tools like:

Wafer bonder

Wire bonder

Wafer dicer

Probe station

Mask writer

4 point probe

Mask aligner

Surface profiler

Furnace

Sputter

Evaporator

Reactive ion etching