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Reactive-ion etching, plasma etching, and wet chemical etching are all processes that URMIA MEMES utilizes in the fabrication of MEMS devices. Plasma etching is available for photoresist removal, isotropic dielectric etching and organic polymer etching. Wet chemical etching of a variety of materials is performed with pre-mixed, stabilized etchants for repeatability and etch control.

Reactive Ion Etching

  • Silicon nitride
  • Polysilicon, anisotropic
  • Polysilicon, isotropic
  • Silicon, isotropic
  • Silicon, anisotropic

Plasma Etching

  • Photoresist removal
  • Polymer removal


Wet Etching

  • Silicon
  • Polysilicon
  • Silicon dioxide
  • Silicon nitride
  • Aluminum
  • Aluminum/Silicon
  • Titanium
  • Chromium
  • Tungsten