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Furnace Processing

Capture

High-temperature processing is performed in horizontal furnaces capable of handling batch sizes of up to 10 wafers at a time. We are capable to oxidation on 4 inch wafer with typical within-wafer uniformity of less than ±10%.

Capabilities

  • Wet oxidation
  • Dry oxidation
  • POCl3 doping, n-type
  • Boron doping, p-type
  • Metal anneal, N2