URMIA MEMES’s i-line photolithography tool set is specifically tailored for MEMS production. Our line is capable of handling quartz, silicon, transparent, and semi-transparent substrates; as well as multiple photoresist processes. A robust, dual-layer resist is used for lift-off processing. Hard Contact, Soft Contact, vacuum Contact, low vacuum and proximity & exposure is capable of resolving features as small as 1 µm. Backside alignment is used for double-sided photolithography.