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Photolithography

Capture

 

URMIA MEMES’s i-line photolithography tool set is specifically tailored for MEMS production. Our line is capable of handling quartz, silicon, transparent, and semi-transparent substrates; as well as multiple photoresist processes. A robust, dual-layer resist is used for lift-off processing. Hard Contact, Soft Contact, vacuum Contact, low vacuum and proximity & exposure is capable of resolving features as small as 1 µm. Backside alignment is used for double-sided photolithography.

Capabilities

  • Positive resist
  • Dual-layer lift-off resist
  • Thick & double-coat resist (4-22 µm)
  • Contact alignment & exposure
  • Proximity alignment & exposure
  • Back-side alignment & exposure
  • SU-8 processing