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Sputtering and Evaporation

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URMIA MEMES’s metal and semi-metal deposition capabilities are world-class. Our automated sputtering and evaporation systems are able to deposit a wide range of materials. Sputtering capabilities include DC and RF magnetron sputtering from one target materials. Our deposition tools are capable of deposition on 4 inch wafer with typical within-wafer uniformity of less than ±10%.

Sputtering

Metals

  • Aluminum
  • Titanium
  • Tungsten
  • Nickel
  • Copper
  • Molybdenum
  • Zn

Metal oxide

  • VOx
  • CrOx

Alloys

  • Aluminum-Silicon
  • Ni-chrome

 

 

Evaporation

Metals

  • Aluminum
  • Copper